| 摘要 |
PROBLEM TO BE SOLVED: To provide an overvoltage protection device for an electronic circuit with a simple manufacturing method at a low cost. SOLUTION: A multilayered structure of a buffer layer 41, an internal-electrode conducting layer 42, a dielectric layer 43, and an external-electrode conducting layer 44 is formed on a ceramic substrate, with a gap 5 of an appropriate depth to intersect the ceramic substrate in a cutting process after completion of overall structure. Accordingly, two overlapped electrode layers 42, 44 are divided to two opposite portions by the transversing gap, and also divided to the internal and external electrode conducting layers 42, 44 by the dielectric layer 43. Different kind of solid or gaseous material is injected into the gap 5 by using the structure, and therefore the gap serves as a protecting element against an electrostatic discharge by using the dielectric layer 43 of the appropriate thickness, thereby resulting in utilizing all the structure as the protection elements to various kinds of electronic circuits. COPYRIGHT: (C)2009,JPO&INPIT
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