发明名称 RESIST UNDERLAYER FILM FORMING COMPOSITION FOR LITHOGRAPHY, CONTAINING AROMATIC FUSED RING-CONTAINING RESIN
摘要 There is provided a resist underlayer film forming composition for lithography, which in order to prevent a resist pattern from collapsing after development in accordance with the miniaturization of the resist pattern, is applied to multilayer film process by a thin film resist, has a lower dry etching rate than resists and semiconductor substrates, and has a satisfactory etching resistance relative to a substrate to be processed in the processing of the substrate. A resist underlayer film forming composition used in lithography process by a multiplayer film, comprises a polymer containing a unit structure having an aromatic fused ring, a unit structure having a protected carboxyl group or a unit structure having an oxy ring. A method of forming a pattern by use of the resist underlayer film forming composition. A method of manufacturing a semiconductor device by utilizing the method of forming a pattern.
申请公布号 US2010022090(A1) 申请公布日期 2010.01.28
申请号 US20070312607 申请日期 2007.11.27
申请人 NISSAN CHEMICAL INDUSTRIES, LTD. 发明人 SAKAGUCHI TAKAHIRO;ENOMOTO TOMOYUKI;SHINJO TETSUYA
分类号 H01L21/311;C08G63/40;C08G63/42;C08K5/10;C08K5/15;H01L21/30 主分类号 H01L21/311
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