发明名称 |
RESIST UNDERLAYER FILM FORMING COMPOSITION FOR LITHOGRAPHY, CONTAINING AROMATIC FUSED RING-CONTAINING RESIN |
摘要 |
There is provided a resist underlayer film forming composition for lithography, which in order to prevent a resist pattern from collapsing after development in accordance with the miniaturization of the resist pattern, is applied to multilayer film process by a thin film resist, has a lower dry etching rate than resists and semiconductor substrates, and has a satisfactory etching resistance relative to a substrate to be processed in the processing of the substrate. A resist underlayer film forming composition used in lithography process by a multiplayer film, comprises a polymer containing a unit structure having an aromatic fused ring, a unit structure having a protected carboxyl group or a unit structure having an oxy ring. A method of forming a pattern by use of the resist underlayer film forming composition. A method of manufacturing a semiconductor device by utilizing the method of forming a pattern.
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申请公布号 |
US2010022090(A1) |
申请公布日期 |
2010.01.28 |
申请号 |
US20070312607 |
申请日期 |
2007.11.27 |
申请人 |
NISSAN CHEMICAL INDUSTRIES, LTD. |
发明人 |
SAKAGUCHI TAKAHIRO;ENOMOTO TOMOYUKI;SHINJO TETSUYA |
分类号 |
H01L21/311;C08G63/40;C08G63/42;C08K5/10;C08K5/15;H01L21/30 |
主分类号 |
H01L21/311 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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