A filter package comprises: a substrate; a plurality of resonators individually coupled to the substrate; and a metal circuit pattern patterned on the substrate. Each of the resonators includes: a body composed of a dielectric material, and having a through-hole formed in one direction; and a conductive layer coupled to a cross section coupled to the substrate from cross sections of both sides in the body and a wall of the through-hole.
申请公布号
KR20160066727(A)
申请公布日期
2016.06.13
申请号
KR20140171855
申请日期
2014.12.03
申请人
INNERTRON, INC.
发明人
CHO, HAK RAE;SEO, SOO DUK;HA, JONG WOO;KO, MOON BONG