发明名称 FILTER PACKAGE
摘要 A filter package comprises: a substrate; a plurality of resonators individually coupled to the substrate; and a metal circuit pattern patterned on the substrate. Each of the resonators includes: a body composed of a dielectric material, and having a through-hole formed in one direction; and a conductive layer coupled to a cross section coupled to the substrate from cross sections of both sides in the body and a wall of the through-hole.
申请公布号 KR20160066727(A) 申请公布日期 2016.06.13
申请号 KR20140171855 申请日期 2014.12.03
申请人 INNERTRON, INC. 发明人 CHO, HAK RAE;SEO, SOO DUK;HA, JONG WOO;KO, MOON BONG
分类号 H01P1/20 主分类号 H01P1/20
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