发明名称 IMPEDANCE BOND HAVING IMPROVED STRUCTURE STABILITY AND INSULATING PROPERTY
摘要 The present invention relates to an impedance bond having improved structural stability and insulation and, more specifically, to an impedance bond having improved structural stability, in which structures of a bus and a transformer are improved. The impedance bond comprises: an empty receiving box (B) having a connection slot (NH) formed therein; a neutral bus (11) and track buses (12a, 12b) disposed in the receiving box (B) and having a connection terminal discharged outside of the receiving box via the connection slot (NH); a pair of supporters (S1, S2) disposed on opposite sides in the receiving box (B) and supporting the neutral bus (11) and the track buses (12a, 12b); a pair of coils (14a, 14b) disposed between the pair of supporters (S1, S2); a pair of cores (13a, 13b) coupled to the pair of coils; insulating plates (In1, In2, In3) coupled to the connection slot (NH); and a pair of clamping bars (LB) connecting the pair of supporters (S1, S2).
申请公布号 KR20160075486(A) 申请公布日期 2016.06.29
申请号 KR20160077940 申请日期 2016.06.22
申请人 KIM, DONG UK 发明人 KIM, DONG UK;LEE, WON HYEONG
分类号 B61L3/02;H01F27/32 主分类号 B61L3/02
代理机构 代理人
主权项
地址