Electronic component with electronic chip between redistribution structure and mounting structure

摘要

An electronic component which comprises an electrically conductive mounting structure, an electronic chip on the mounting structure, an electrically conductive redistribution structure on the electronic chip, and a periphery connection structure electrically coupled to the redistribution structure and being configured for connecting the electronic component to an electronic periphery, wherein at least one of the electrically conductive mounting structure and the electrically conductive redistribution structure comprises electrically conductive inserts in an electrically insulating matrix.

主权项

1. An electronic component, the electronic component comprising:
an electrically conductive mounting structure; an electrically conductive carrier structure, on which the electrically conductive mounting structure is arranged: an electronic chip on the mounting structure; an electrically conductive redistribution structure on the electronic chip; a periphery connection structure electrically coupled to the redistribution structure and being configured for connecting the electronic component to an electronic periphery; the mounting structure being a contract structure such that the electronic chip is double sided electrically coupled via the mounting structure on the one side and the redistribution structure on the other side; wherein the periphery connection structure is configured as at least one electrically conductive leg, in particular a plurality of electrically conductive legs and wherein each of the at least one leg has a first connection portion and an opposing second connection portion, the first connection portion being electrically connected to the redistribution structure, and the second connection portion being configured for being plugged into a plug-in position of a board as the electronic periphery.