Reinforcement structure and method for controlling warpage of chip mounted on substrate

摘要

A semiconductor device comprises a substrate, a die mounted on the substrate, a reinforcement plate bonded to the die, and an adhesive layer coupling the reinforcement plate to the die.

主权项

1. A semiconductor device, comprising:
a substrate; a die mounted on the substrate; a reinforcement plate comprising glass bonded to the substrate, wherein the reinforcement plate has a periphery and a center region, and wherein the reinforcement plate is continuous from a top leftmost corner of the periphery to a bottom rightmost corner of the periphery through the center region; and an adhesive layer coupling the reinforcement plate to the substrate.