BIOMETRICS SENSOR MODULE INCLUDING FILM COVER AND PACKAGING METHOD OF BIOMETRICS SENSOR

摘要

A biometrics recognition sensor module fundamentally includes: a substrate: a biometrics recognition sensor mounted on the substrate; and a signal connection part formed on the substrate to connect the biometrics recognition sensor and an external circuit. The biometrics recognition sensor module has: an adhesive layer formed on the biometrics recognition sensor; and a hard film layer attached to the upper portion of the biometrics recognition sensor by the adhesive layer. The present invention can minimize a distance between a pixel of a fingerprint recognition sensor and a fingerprint, thereby maximizing recognition accuracy of the fingerprint recognition sensor.