Fabricating two-dimensional array of four-terminal thin film devices with surface-sensitive conductor layer

摘要

A technique relates to a semiconductor device. First metal contacts are formed on top of a substrate. The first metal contacts are arranged in a first direction, and the first metal contacts are arranged such that areas of the substrate remain exposed. Insulator pads are positioned at predefined locations on top of the first metal contacts, such that the insulator pads are spaced from one another. Second metal contacts are formed on top of the insulator pads, such that the second metal contacts are arranged in a second direction different from the first direction. The first and second metal contacts sandwich the insulator pads at the predefined locations. Surface-sensitive conductive channels are formed to contact the first metal contacts and the second metal contacts. Four-terminal devices are defined by the surface-sensitive conductive channels contacting a pair of the first metal contacts and contacting a pair of the metal contacts.

主权项

1. A method of fabricating a semiconductor device, the method comprising:
forming first metal contacts on top of a substrate, the first metal contacts being arranged in a first direction, wherein the first metal contacts are arranged such that areas of the substrate remain exposed; forming insulator pads at predefined locations on top of the first metal contacts, such that the insulator pads are spaced from one another; forming second metal contacts on top of the insulator pads, such that the second metal contacts are arranged in a second direction different from the first direction, wherein the first and second metal contacts sandwich the insulator pads at the predefined locations; depositing a surface-sensitive conductive layer on top of the first plurality of metal contacts, the second plurality of metal contacts, the insulator pads, and the substrate; and etching the surface-sensitive conductive layer to leave conductive channels, the etching including removing the surface-sensitive conductive layer from the insulator pads and removing the surface-sensitive conductive layer from the first and second metal contacts at the predefined locations to form four-terminal devices, wherein each of the four-terminal devices is defined by a conductive channel contacting a pair of the first metal contacts and contacting a pair of the second metal contacts; wherein the surface-sensitive conductive layer includes at least one of:
topological insulators having Bi and at least one of Te, Sb, and Se;material including graphene;material including MoS or MoSe; anda magnetic film.