| 发明名称 | Liquid cooling apparatus | ||
| 摘要 | A liquid cooling apparatus includes a plurality of system boards each having a first surface and a second surface opposite the first surface, each of the system boards having at least one electronic component mounted on the first surface, a cooling plate attached to the electronic component and having a pathway formed therein through which coolant flows, one or more heat conductive members penetrating through any given one of the system boards, and a heat dissipating member disposed on the second surface of any given one of the system boards and connected to the one or more heat conductive members, wherein an emissivity of the heat dissipating member is higher than an emissivity of the one or more heat conductive members. | ||
| 申请公布号 | US9420720(B2) | 申请公布日期 | 2016.08.16 |
| 申请号 | US201414258389 | 申请日期 | 2014.04.22 |
| 申请人 | FUJITSU LIMITED | 发明人 | Takasu Yoichi |
| 分类号 | H05K7/20;G06F1/20;H01L23/473 | 主分类号 | H05K7/20 |
| 代理机构 | Kratz, Quintos & Hanson, LLP | 代理人 | Kratz, Quintos & Hanson, LLP |
| 主权项 | 1. A liquid cooling apparatus, comprising: a plurality of system boards each having a first surface and a second surface opposite the first surface, each of the system boards being a flat plate, and each of the system boards having at least one electronic component mounted on the first surface; a cooling plate attached to the electronic component and having a pathway formed therein through which coolant flows; one or more heat conductive members penetrating through any given one of the system boards that is a flat plate; and a heat dissipating member disposed on the second surface of any given one of the system boards and connected to the one or more heat conductive members, wherein an emissivity of the heat dissipating member is higher than an emissivity of the one or more heat conductive members. | ||
| 地址 | Kawasaki JP | ||