发明名称 |
Electronic devices with yielding substrates |
摘要 |
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts. |
申请公布号 |
US9426860(B2) |
申请公布日期 |
2016.08.23 |
申请号 |
US201514976698 |
申请日期 |
2015.12.21 |
申请人 |
Cooledge Lighting, Inc. |
发明人 |
Tischler Michael A.;Schick Philippe M.;Ashdown Ian;Sheen Calvin Wade;Jungwirth Paul |
分类号 |
H01L21/66;H01L33/00;H05B33/08;F21K99/00;H01L31/0468;H01L31/042 |
主分类号 |
H01L21/66 |
代理机构 |
Morgan, Lewis & Bockius LLP |
代理人 |
Morgan, Lewis & Bockius LLP |
主权项 |
1. A method for operating a lighting system that comprises (i) a primary lighting module, (ii) a plurality of nearest-neighbor lighting modules proximate the primary lighting module, and (iii) a plurality of next-nearest neighbor lighting modules each disposed at a distance away from the primary lighting module greater that a distance between a nearest-neighbor lighting module and the primary lighting module, the method comprising:
sensing a characteristic with the primary lighting module; with the primary lighting module, emitting light having a first intensity determined at least in part by the sensed characteristic; with each nearest-neighbor lighting module, emitting light having a second intensity determined at least in part by the first intensity of light emitted by the primary lighting module without sensing the characteristic sensed by the primary lighting module; and with each next-nearest-neighbor lighting module, emitting light having a third intensity determined at least in part by the second intensity of light emitted by each nearest-neighbor lighting module without sensing the characteristic sensed by the primary lighting module. |
地址 |
Richmond CA |