| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor manufacturing equipment and a lead frame used for it so as to improve productivity and reliability. SOLUTION: A lead frame 10 mounted with a semiconductor component to be sealed is arranged in a cavity 4, which is closed by a top die 3a and a bottom die 3b, the cavity is filled with sealing resin 9 which is melted by heat, and the sealing resin is solidified to obtain a resin-sealed semiconductor device. Two gates 5a and 5b are provided on the bottom die 3b so as to supply the sealing resin material 9 into the cavity 4 in the two directions, which are almost connected by the diagonal line of the cavity 4, at the same time. |
