CIRCUIT MEMBER FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING THEM

摘要

A circuit member for coping with the further increase of terminals of a semiconductor device, having advantages in production, cost, and quality, a semiconductor device using the circuit member, and methods for manufacturing the circuit member and semiconductor device using the circuit member. The circuit member has a conductive substrate and a circuit section two-dimensionally formed by plating with conductive metal on the substrate. Part of the conductive metal forming the circuit section is formed on one surface of the conductive substrate by plating after the surface of the substrate is roughened and processed to impart removability. The circuit section is provided with a plurality of independent sets of leads for electrical connection to a semiconductor element and external terminal sections for electrical connection to external circuits. The external terminal sections are directly formed on one surface of the conductive substrate by electroplating and the leads are formed on an insulating epoxy resin layer directly formed on the conductive substrate except external terminal forming areas.