发明名称 |
HANDOTAISOCHIKAADOYOFUREEMUOYOBIKOREOSHOSHITAHANDOTAISOCHIKAADONARABINISONOSEIZOHOHO |
摘要 |
<p>A semiconductor device card and a method of manufacturing the card. A frame includes an integral spacer which fills a dead space on a circuit board to eliminate the need for positioning a separate spacer in the dead space on the circuit board and fixing the spacer in place with a bonding sheet or the like. In a semiconductor device card in which a spacer for filling a dead space on the circuit board is bonded to a corresponding panel, a recess is formed on the surface of the spacer bonded to the obverse or reverse panel to reduce undulations occurring in the panel surface.</p> |
申请公布号 |
JP2634284(B2) |
申请公布日期 |
1997.07.23 |
申请号 |
JP19900078294 |
申请日期 |
1990.03.26 |
申请人 |
MITSUBISHI DENKI KK |
发明人 |
KAMINAKA TAKESHI;OOBUCHI ATSUSHI;MAEDA HAJIME;TACHIKAWA TOORU;ONODA SHIGEO |
分类号 |
B42D15/10;B42D15/00;G06K19/077;H05K5/02;H05K7/14;(IPC1-7):B42D15/10;H05K1/02;H01L21/58;G11C5/00 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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