INSULATING PORCELAIN AND MULTILAYERED WIRING SUBSTRATE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a low-cost insulating porcelain capable of being baked at low temperatures by forming and baking a mixture of a specific glass having a low yield point with a filler comprising a specific metallic oxide. SOLUTION: This insulating porcelain is obtained by forming a mixture of 20-50vol.% crystallizable glass having <=8ppm/ deg.C linear thermal expansion coefficient at 40-400 deg.C and 400-600 deg.C yield point without containing Pb with 50-80vol.% filler comprising a metallic oxide having <=8ppm/ deg.C linear thermal expansion coefficient at 40-400 deg.C and then baking the resultant formed mixture. The linear thermal expansion coefficient of the produced porcelain is <=6.5ppm/ deg.C. A conductor consisting essentially of copper is arranged in the interior or the surface of the insulating porcelain to form the multilayered wiring substrate.