| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the solder crack of the tie- in section of a contact when external force is applied to the contact mounted on a board by providing a void between adjacent wall faces of contact holes. SOLUTION: A housing 50 is provided with contact holes 54 to be inserted with contacts 40 having tie-in sections 42, and a void 62 is provided between wall faces of adjacent holes 54. When external force is applied to a contact 40 mounted on a board, the hole 54 acts to mitigate the external force, the contact 40 pressed into the hole 54 is relatively moved, the external force applied to the solder of the tie-in section 42 is mitigated, and the occurrence of the solder crack of the tie-in section 42 can be prevented.</p> |
