| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to repair, select, and perform appearance inspection for connections and aging while maintaining high-density mountability of bare chips which were previously difficult to perform. SOLUTION: Bare chip mounting is performed with a semiconductor chip 1 on a small substrate 4 with a low thermal expansion relatively close to the coefficient of thermal expansion of semiconductor chip 1 by CCB connections using bumps; a mounting electrode 7 of copper foil wiring and an electrode 6 for aging of copper foil wiring on the small substrate 4 are provided at the end of the small substrate 4; thereby vertically mounting the small substrate 4 with solder on a mounting substrate 8. By doing this, the electrode 7 for mounting is provided at the end of the small substrate 4, vertical mounting with solder is possible for the mounting substrate 8, by which repairing and soldering appearance inspection become possible. Moreover, a screening and aging electrode 6 can be attached to the rear surface of the small substrate 4, so that the preparation for screening and aging jigs can be made easier. |
