Improved compositions for polishing silicon, silica or silicon-containing articles is provided which consists of an aqueous medium, abrasive particles and an anion which controls the rate of removal of silica. The anion is derived from a class of compounds which contain at least two acid groups and where the pKa of the first dissociable acid is not substantially larger than the pH of the polishing composition. Methods using the composition to polish or planarize the surfaces of work pieces, as well as products produced by such methods, are also provided.
申请公布号
DE706582(T1)
申请公布日期
1996.10.24
申请号
DE19940918171T
申请日期
1994.05.25
申请人
RODEL, INC., NEWARK, DEL., US
发明人
BRANCALEONI, GREGORY, NEWARK, DE 19702, US;COOK, LEE MELBOURNE, STEELVILLE, PA 19310, US