发明名称 EVACUATING METHOD OF APPARATUS FOR VACUUM VAPOR DEPOSITION
摘要 PURPOSE:To contrive to achieve the speedup and efficiency increase of vacuum, vapor deposition process, by introducing preliminary evaporation process of the same deposition material in that exhaust process by using a conventional apparatus for vacuum vapor deposition. CONSTITUTION:The evaporation source 3 loaded with deposition material 2 and the substrate 4 to be deposited are stored in the vacuum chamber 1 and the pressure inside the vacuum chamber is reduced to more than one third the required ultimate obtainable vacuum degree of preset value, for example, 2X10<-6> Torr with an exhaust system. Then, it is exhausted to the required ultimate obtainable vacuum degree, for example, 1X10<-6> Torr preliminarily evaporating the deposition material 2 by applying one half degree of normal input at evaporation, for example, about 5kVA input to the evaporation source 3. When preliminarily evaporated in the exhaust process after 2X10<-6> Torr, a shutter 5 is closed and the shutter 5 is so operated as to be opened by making the applied input of evaporation source 3 a rated input, for example, about 10kVA when the ultimate vacuum degree is reached.
申请公布号 JPS5983762(A) 申请公布日期 1984.05.15
申请号 JP19820192956 申请日期 1982.11.02
申请人 MATSUSHITA DENSHI KOGYO KK 发明人 TAKADA MASAHIRO;NISHIMURA SHIGERU;TANAKA KOUJI;TOMIOKA KOUZOU;MATSUBARA YOSHIO;SAITOU AKIO
分类号 C23C14/24 主分类号 C23C14/24
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