| 摘要 |
PURPOSE:To perform a small package by using a silicon substrate transparent for an infrared ray as a package, and forming an infrared ray filter on the back surface of the substrate to eliminate the difference of thermal expansion coefficient between an infrared ray solid state image sensor and the package. CONSTITUTION:Since an infrared light is incident from the back surface of a silicon substrate 14 and the substrate 14 is transparent for the infrared ray, the infrared lights of wavelengths lambda1, lambda2, lambda3 are incident to infrared ray solid- state image sensors 11, 12, 13 through infrared ray filters 15, 16, 17, respectively. The terminals of the sensors 11, 12, 13 are led to the periphery of the substrate 14 by multilayer wirings formed on the front surface of the substrate 14. Since the common terminal of these terminals can be coupled by wirings in the substrate 14, the number of the terminals to be led t the periphery of the substrate 14 can be minimized as required. Thus, the difference of thermal expansion coefficient between the substrate of low temperature and the sensors is eliminated, and wirings led to the terminals of the sensors can be microminiaturized similarly to an integrated circuit, and multilayer wirings can be facilitated. |
