| 摘要 |
<p>PURPOSE:To obtain a printed wiring board for an IC card constituted so as not to generate air bubbles in the opening of a base material by filling the opening of a base material with a conductive material to use the surface thereof as a bonding terminal for wire bonding. CONSTITUTION:When a printed wiring board 100 for an IC card is prepared, a base material 10 composed of a glass epoxy resin having an adhesive 30 applied to the single surface thereof is punched by a die to form a part becoming a cavity 11 and an opening 12. Next, a rolled copper foil 20 is bonded to an adhesive layer 30 by a heat-bonding press to perfectly cure the adhesive layer 30. Subsequently, a contact terminal 21 is formed through a resist forming process, an etching process and a film releasing process and, thereafter, a plating resist is formed. Next, thick copper plating 23 is applied to the opening 12 of the base material 10 by copper plating and, at last, the plating resist is released and nickel plating is subsequently applied to the thick copper plating 23 applied to both of the surface of the contact terminal 21 and the opening 12 of the base material 10 and gold plating is further applied to form a surface plating layer 40. As a result, an IC card module generating no air bubbles in the opening is obtained.</p> |
