| 摘要 |
PURPOSE:To provide the subject composition giving semiconductors generating no crack when soldered and having high reliability by compounding an epoxy resin, a hardening agent, fused silica and a polystyrenic block copolymer subjected to a specific thermal treatment. CONSTITUTION:An epoxy resin composition comprises (A) an epoxy resin, (B) a hardening agent, (C) a polystyrenic block copolymer thermally treated at 150-280 deg.C for 3-30min and (D) fused silica. The component A preferably contains >=50% of an epoxy resin having an epoxy equivalent of >=300 such as a cresol novolak epoxy resin. The component C contains styrene, butadiene, etc., as the monomers thereof and is especially preferably the hydrogenation product of polystyrene/polyisoprene/polystyrene triblock copolymer. |
