发明名称 FUSED MICROWAVE SUSCEPTOR
摘要 A conductive structure for use in microwave food packaging which adapts itself to heat food articles in a safer, more uniform manner is disclosed. The structure includes a conductive layer (103) disposed on a non-conductive substrate (101). Provision in the structure's conductive layer (103) of fuse links (109) and base areas (107) causes microwave induced currents to be channeled through the fuse links (109), resulting in a controlled heating. When over-exposed to microwave energy, fuses break more readily than the conductive base areas (107) resulting in less absorption of microwave energy in the area of fuse breaks than in other regions where fuses do not break. In this way the fused microwave conductive structure compensates for the uneven microwave field within a microwave oven and at the same time provides a safer conductive structure less likely to overheat. In addition, by varying the dimensions of the fuse links and base areas it is possible to design and fabricate different fused microwave conductive structures having a wide range of heating characteristics. Thus, a fused microwave conductive structure permits food heating temperatures to be tuned for food type.
申请公布号 WO9519926(A1) 申请公布日期 1995.07.27
申请号 WO1995US00900 申请日期 1995.01.23
申请人 ADVANCED DEPOSITION TECHNOLOGIES, INC. 发明人 WALTERS, GLENN, J.;MCCORMICK, JOHN, A.
分类号 A23L5/10;A47J27/00;B65D81/34 主分类号 A23L5/10
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