发明名称 LEAD FRAME
摘要 PURPOSE:To improve the connection strength between a lead and a gold wire by exposing the core material of a tape partially without exposing a binder all over the surface of the adhesive tape. CONSTITUTION:The inner lead of a lead 1 extended from an outer frame 6 is bonded to a heat radiation plate 2 through an insulating two-sided thermosetting adhesive tape 3. The junction part 7 with the inner lead section and the junction part 8 with the heat radiation plate 2 are constituted such that the adhesive face 32 and the core face 34 are partially exposed. Since the exposure of the adhesive face is small, the generation of the organic gas is suppressed, and the connection strength of the wire connection on a lead can be improved without causing the shortage of connection strength resulting from an adhesive adhering to the wire connection face on an inner lead.
申请公布号 JPH07130931(A) 申请公布日期 1995.05.19
申请号 JP19930276566 申请日期 1993.11.05
申请人 TOPPAN PRINTING CO LTD 发明人 TSUKAMOTO TAKETO;SEKINE HIDEKATSU
分类号 H01L21/60;H01L23/50 主分类号 H01L21/60
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