发明名称 |
TIN BISMUTH SOLDER PASTE, AND METHOD USING PASTE TO FORM CONNECTION HAVING IMPROVED HIGH TEMPERATURE PROPERTIES |
摘要 |
A solder paste (24 in Fig. 1) of the type utilized in forming a solder connection (32 in Fig. 2) for a microelectronic package comprises a mixture of compositionally distinct metal powders. The paste comprises a first metal powder formed of tin-bismuth solder alloy. The paste further comprises a second metal powder containing gold or silver. During reflow, the gold or silver alloys with the tin-bismuth solder to increase the melting part and enhance mechanical properties of the product connection.
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申请公布号 |
CA2140253(C) |
申请公布日期 |
1998.12.22 |
申请号 |
CA19942140253 |
申请日期 |
1994.04.05 |
申请人 |
MOTOROLA, INC. |
发明人 |
MELTON, CYNTHIA M.;BECKENBAUGH, WILLIAM;MILLER, DENNIS |
分类号 |
B23K35/22;B23K35/02;B23K35/26;H05K3/34;(IPC1-7):B23K35/34;B23K35/24 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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