发明名称 Device and method for multiplying capacitance
摘要 A semiconductor device (400) and method are provided for multiplying a capacitance. A contact region (402) is formed in an island in a semiconductor substrate (499) bounded by an isolation region (403), producing the capacitance at the junction of the contact region (402). A dielectric layer (404) is formed over the semiconductor substrate (499) adjacent to the contact region (402). A contact layer (408) is formed over the dielectric layer (404) wherein an inversion layer (406) is formed under the contact layer (408), producing an inversion capacitance in response to an enabling signal. The inversion capacitance corresponds to a multiple of the capacitance.
申请公布号 US5894163(A) 申请公布日期 1999.04.13
申请号 US19960639479 申请日期 1996.04.02
申请人 MOTOROLA, INC. 发明人 MCFARLAND, DUNCAN A.;CROHN, DAVID C.
分类号 H01L27/04;H01L21/822;H01L29/94;H03H7/30;H03H11/40;(IPC1-7):H01L29/00 主分类号 H01L27/04
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