发明名称 GROUND CLIP APPARATUS FOR CIRCUIT BOARDS
摘要 <p>A ground clip apparatus is designed to make ground contact between two circuit boards (22, 24) as they are mated together. A standoff member (10) is mounted on one of the boards and a spring clip (12) member is mounted on the other board facing the standoff member. The spring clip member has spring arms (18) which are biased against the standoff member when the boards are mated together to make a reliable ground contact. At the same time, the standoff member resists deflection of either board towards the other board.</p>
申请公布号 WO9929151(A1) 申请公布日期 1999.06.10
申请号 WO1998US25419 申请日期 1998.11.30
申请人 QUALCOMM INCORPORATED 发明人 MORAN, SEAN, A.
分类号 H01R12/52;H01R13/24;H05K3/34;H05K3/36;H05K3/40;H05K7/14;H05K9/00;(IPC1-7):H05K7/14;H01R9/09 主分类号 H01R12/52
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