| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a photocoupler capable of facilitating alignment in the case of packaging a substrate, by a method wherein the dispersion of the packaging positions on a substrate, the slippage in the turning direction on the packaging surface as well as the inverse insertion inverting the positions of a light emitting element and a photo-detecting element are avoided. SOLUTION: In a photocoupler packaged to be composed on a substrate wherein a light emitting element converting electric signal into photosignals as well as a photo-detecting element converting the photosignals into the electric signals oppositely arranged in different lead frames to be molded, multiple projections 9a, 9b are provided on the surface of a substrate 10, while multiple recessions 10a, 10b corresponding to the projections 9a, 9b are provided on the substrate 10.</p> |
