METHOD AND DEVICE OF PROVIDING LEAD FRAME

摘要

In a bonding apparatus such as a wire bonding apparatus, die bonding apparatus and the like in which lead frames are supplied from a lead frame magazine to a bonding section via a frame conveying path, when the absence of a lead frame in the frame storing section of a lead frame magazine is detected by a sensor in spite of the fact that a frame pusher for pushing out the lead frame from the magazine has operated, a judgement is made that no more lead frames are contained in the frame magazine, so that a lowermost frame storing section of the next magazine is moved to the level of the frame conveying path.