| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board whose connection reliability of a via hole can be improved and to provide a manufacturing method of the multilayer printed wiring board. SOLUTION: Voids 35a are installed on the roughened face 35 of a conductor circuit 29. In the voids 35a, affinity with plating liquid is superior and plating infiltrates into the voids 35a and is beset in an anchor part in a plating process. Thus, the roughened face 35 of the conductor circuit 29 is adhered still more closely with the via holes 130. Namely, plating is inserted into the conductor of the via holes 130 in the voids 35a of the conductor circuit 29 at forming of the via hole 130 on the lower conductor circuit 29, so that adhesion can be enhanced. |
