发明名称 INSPECTION METHOD FOR SEALED PACKAGE
摘要 <p>The invention provides an efficient inspection method for inspecting a hermetically sealed package for pinholes, in which when a hermetically sealed package in which contents such as electrically conductive fluid or food are covered with an electrically insulating film is inspected for pinholes by using a high voltage, the inspection can be achieved with an extremely simple procedure while fully preventing occurrence of misoperations due to the atmosphere such as humidity during the inspection. In a hermetically sealed package in which contents 1 such as electrically conductive fluid are covered with an electrically insulating film 2, an electrical conductor 4 derived from a voltage output terminal of a DC high voltage power supply 6 is put into contact with or proximity to a side face portion 31 of the hermetically sealed package, by which the contents 1 in the hermetically sealed package 3 are electrified. Next, a lead wire 8 is connected to a connecting terminal 5a of an electrode 5 put into close contact with or opposed proximity to an inspection-object portion 3a of the package 3 where pinholes are most likely to occur, and the lead wire 8 is grounded. Then, a discharge current derived from the inspection-object portion 3a that flows only when a pinhole is present is detected by a discharge current detector 7, by which the presence or absence of a pinhole is detected depending on the presence or absence of the discharge current. In this procedure, the inspection can be made by placing the package on a support electrode derived from an AC high voltage power-supply-and electrifying the contents. &lt;IMAGE&gt;</p>
申请公布号 EP1167956(A1) 申请公布日期 2002.01.02
申请号 EP20000904079 申请日期 2000.02.21
申请人 JOVEN DENKI KABUSHIKI KAISHA 发明人 YASUMOTO, KENJI
分类号 B65B57/00;G01M3/40;G01N27/20;G01N27/92;(IPC1-7):G01N27/24 主分类号 B65B57/00
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