| 发明名称 |
METHODS OF PROCESSING AND MANUFACTURING SUBSTRATE |
| 摘要 |
PROBLEM TO BE SOLVED: To increase the yield of laminated substrates. SOLUTION: Two substrates are laminated to form a laminated substrate. Then, a wedge 5 is inserted near a void 3 to temporarily separate (strip off) a part of the substrate which includes the void 3. Thereafter, the wedge 5 is pulled off to cause the separated part to airtightly adhere to its original place again.
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| 申请公布号 |
JP2002016239(A) |
申请公布日期 |
2002.01.18 |
| 申请号 |
JP20000196835 |
申请日期 |
2000.06.29 |
| 申请人 |
CANON INC |
发明人 |
TAKIZAWA TORU;YAMAGATA KENJI |
| 分类号 |
H01L21/20;H01L21/02;H01L21/336;H01L27/12;H01L29/786;(IPC1-7):H01L27/12 |
主分类号 |
H01L21/20 |
| 代理机构 |
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代理人 |
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