| 摘要 |
PROBLEM TO BE SOLVED: To improve the holding strength of a more miniaturized piezoelectric vibrating element, without obstructing the vibration of the piezoelectric vibrating element. SOLUTION: In the holding structure for piezoelectric vibrating device, with which a piezoelectric vibrating element 3 provided with an excitation electrode and a lead electrode is electrically connected via a conductive bonding member to an insulated substrate 1, formed with a extraction electrode 21 conducted with an external circuit and sealed airtightly by a lid body 4, the area of smaller vibration displacement between the extraction electrode and the lead electrode of the piezoelectric vibrating element is electrically connected by a conductive resin adhesive 51 containing conductive fillers and mechanically bonded by a resin adhesive 52 which does not contain conductive fillers, composed of the same material as the conductive resin adhesive over an area, which includes the application area of the conductive resin adhesive, wider tan the application area.
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