CHIP SCALE PACKAGE, CIRCUIT BOARD, ELECTRONIC MODULE AND METHOD FOR DESIGNING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a chip scale package, a printed circuit board and a method for designing a printed circuit board. SOLUTION: The package of this invention includes a plurality of first signal terminals arranged on a first region of one surface and a plurality of second signal terminals on a second region of the same surface wherein a space of the second signal terminal is layer at least in one direction than that of the first signal terminal. A circuit board of a module includes a plurality of the first signal terminals arranged in each first region of a plurality of chip scale package regions where a plurality chip scale packages are mounted thereon and a plurality of the second signal terminals arranged in each second region of a chip scale package regions where a plurality of chip scale packages are mounted thereon wherein the space of the second signal terminal is larger at least in one direction than that of the first signal terminal and comprises that common signal lines commonly connected between signal lines of a plurality of the first signal terminal and a plurality of the second signal terminals are arranged outside. Thus, it is possible to reduce the number of layers because signal lines can be arranged on both the front surface and the back surface of the module.