| 摘要 |
PROBLEM TO BE SOLVED: To provide a build-up resin composition which is excellent in heat resistance and moisture resistance without generation of hydrogen bromide or the like as a toxic gas at the time of burning, and also to provide a resin film with a carrier sheet excellent in heat resistance and humidity resistance and a build-up multilayer printed circuit board manufactured by using the composition. SOLUTION: The build-up type resin composition contains (A) a thermoplastic or thermosetting resin having a weight-average molecular weight of 10,000 or more, (B) an epoxy resin, (C) silicone powder, (D) phosphate esters, (E) an inorganic filler, (F) a hardening agent, and (G) a hardening promotor as essential components. The composition contains (A) by 5-80 wt.%. The resin film and build-up type multi-layer printed circuit board are manufactured by using the composition. |
