| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a substrate and an apparatus for processing the substrate, which is capable of completing a removal process of reaction products in a short time. SOLUTION: The apparatus for processing the substrate comprises a spin chuck for rotatably holding the substrate W, a mechanism 30 for feeding removal liquid, which feeds the removal liquid toward the surface of the substrate W held by the spin chuck, a brush cleaning mechanism 40, which has a rotation brush 41, abutting with the surface of the substrate W held by the spin chuck or capable of being adjacently arranged, and cleans the surface of the substrate W, and a mechanism 50 for feeding pure water, which feeds the pure water toward the surface of the substrate W held by the spin chuck. |
