发明名称 RESIN CURING METHOD, APPARATUS AND RESIN USED THEREFOR, ARTICLE HAVING FINE SURFACE STRUCTURE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resin curing method capable of uniformizing the thickness of a resin layer before curing the resin layer. SOLUTION: Such a degree of energy as not to attain complete curing is applied to resin on a minuter area part than an area to be cured of the resin to cause a volume change for the resin on the part before a complete curing process of the resin in the state of performing surface matching while holding an uncured photosetting or thermosetting resin 14 between two members 10, 12. At the same time, the region 14a causing the volume change is continuously changed and, thereby, the thickness of the resin layer is uniformized. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006154236(A) 申请公布日期 2006.06.15
申请号 JP20040344130 申请日期 2004.11.29
申请人 RICOH OPT IND CO LTD 发明人 FUJIMURA YASUHIRO;TAKAHASHI TOSHIAKI
分类号 G02B5/18;B29C39/10;B29L11/00 主分类号 G02B5/18
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