发明名称 LEAD FRAME FOR SEMI-CONDUCTOR PACKAGE
摘要 A lead frame for a semiconductor package is provided to prevent the generation of a mold flash phenomenon in a mold process for the semiconductor package by using a bent portion of a lead support part. A lead frame for a semiconductor package includes a chip holding part, a plurality of leads, and a lead support part. The chip holding part is capable of holding at least one semiconductor chip. The plurality of leads(120) are electrically connected with the semiconductor chip. The lead support part is used for supporting the leads. The lead support part is located at an outer portion of a semiconductor package in a semiconductor packaging process. The lead support part has a bent portion(131a) at a predetermined portion. One surface of the chip holding part is exposed to the outside of the semiconductor package.
申请公布号 KR20070093264(A) 申请公布日期 2007.09.18
申请号 KR20060023208 申请日期 2006.03.13
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 KIM, JEUNG IL
分类号 H01L23/495 主分类号 H01L23/495
代理机构 代理人
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