发明名称 BACKLIGHT MODULE STACKED AT LEAST ONE LUMINESCENCE ELEMENT AND FABRICATION THEREOF
摘要 <p>A backlight module with at least one light emitting device and a manufacturing method thereof are provided to mount plural minute light emitting devices with high brightness, thereby emitting the light beam to the wide area. A light emitting device(150) is mounted to at least one cavity formed on a carrier. A lower electrode(130) is formed on a substrate(110). The light emitting device mounted on the carrier is transferred to the substrate, connected with the lower electrode formed on the substrate and thereafter the carrier is removed. An insulation layer(160) is stacked on the surface of the substrate and then the upper area of the light emitting device is exposed. An upper electrode(180) is formed on the exposed light emitting device area. The light emitting device is mounted on the cavity by means of the fluidic-self-assembly manner. In the lower electrode formation process, the insulation material is stacked on the substrate. Thereafter, a metal layer is stacked on the insulation materials and the metal layer is patterned so that the lower electrode is formed. Thereafter, the solder is printed on the lower electrode.</p>
申请公布号 KR100759896(B1) 申请公布日期 2007.09.18
申请号 KR20060053925 申请日期 2006.06.15
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, SEUNG TAE;KWON, KI HWAN;SHIN, SU HO;LIM, JI HYUK;MOON, CHANG YOUL;SHIN, KYU HO
分类号 G02F1/13357;H01L33/00 主分类号 G02F1/13357
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