| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic sensor which can reduce a resonance frequency and can be miniaturized while maintaining the thickness of a substrate to which an ultrasonic vibration element is bonded and ensuring shock resistance. SOLUTION: Cavities such as grooves 14 and holes 15 are formed toward the inside of a substrate 12 from at least one surface of a front surface 12a, a rear surface 12b, and an end surface 12c of the substrate 12. In this way, the rigidity of the substrate 12 can be reduced while maintaining the thickness of the substrate 12. Accordingly, the resonance frequency can be reduced while ensuring the shock resistance of the ultrasonic sensor 10. That means, the ultrasonic sensor 10 can be realized which can reduce the resonance frequency and be miniaturized while maintaining the thickness of the substrate 12 and ensuring shock resistance. COPYRIGHT: (C)2007,JPO&INPIT
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