| 发明名称 |
METHOD OF FORMING PASTE BUMP FOR PRINTED CIRCUIT BOARD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of forming paste bumps, which can decrease the number of times of printing to thus reduce the manufacturing cost and process time in the formation of the paste bumps on the printed circuit board. <P>SOLUTION: The method of forming the paste bumps for the printed circuit board according to the present invention includes the stages of: preparing a base plate; printing conductive paste on the base plate (S10) and then drying the conductive paste (S20) to form first paste bumps 20a; flattening the upper surfaces of the first paste bumps 20a through coining (S30); and printing conductive paste on the first paste bumps 20a (S40) and then drying the conductive paste (S50) to form second paste bumps 20b. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
| 申请公布号 |
JP2008311614(A) |
申请公布日期 |
2008.12.25 |
| 申请号 |
JP20070337555 |
申请日期 |
2007.12.27 |
| 申请人 |
SAMSUNG ELECTRO MECH CO LTD |
发明人 |
MOK JEE SOO;PARK JUN HEYOUNG;KIM KI HWAN;KIM SUNG YONG;PARK SANG HYUN |
| 分类号 |
H05K3/12;H05K3/24 |
主分类号 |
H05K3/12 |
| 代理机构 |
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