发明名称 PICKUP DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a pickup device capable of rapidly picking up a pickup object such as a semiconductor chip. SOLUTION: This pickup device 1 is provided with: a suction collet 2 vertically moving and reciprocatively rotating at 180°; an illumination part 7 illuminating a region of a pickup position P; an imaging part 8 imaging the pickup position P; and a pedestal 5 supporting a suction object 4. The suction collet 2 is provided with a body 10, and two suction parts 11 arranged on the body 10, and is structured such that the two suction parts 11 alternately face the pickup position P of the pedestal 5 every time the body 10 rotates at 180°, and the irradiation direction of the illumination part 7 and the imaging direction of the imaging part 8 are directed to the region of the pickup position P from an obliquely upper side of the suction collet 2 by avoiding the suction collet 2. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008311329(A) 申请公布日期 2008.12.25
申请号 JP20070155957 申请日期 2007.06.13
申请人 OSAKI ENGINEERING CO LTD 发明人 OGUCHI MASAO
分类号 H01L21/67;H01L21/52;H01L21/68 主分类号 H01L21/67
代理机构 代理人
主权项
地址