Exposed pad integrated circuit package with mold lock

摘要

An integrated circuit package has an exposed die pad with a trench and openings in the trench that are filled with encapsulant to form an encapsulant ring near the edges of the die pad. During assembly, the encapsulant passes through the openings and fills the trench to form the encapsulant ring. The ring helps to keep the die pad from separating from the encapsulant caused by thermal cycling. Air vents might be included in the die pad surface to allow air to escape from the trenches and the openings as they fill with encapsulant. Trenches from the openings to the die pad edge on the chip-side of the die pad might be included to increase adhesion of the encapsulant to the die pad.

主权项

1. An article of manufacture, comprising:
a die pad having first and second surfaces, wherein a trench is formed in the first surface, and wherein the trench has a plurality of openings formed therein; and wherein the trench is proximate at least one edge of the die pad and has a longitudinal axis substantially parallel to the at least one edge of the die pad.