Integrated circuit chip comprising electronic device and electronic system

摘要

An electronic device includes a substrate wafer made of many layers of an insulating material and including an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer further includes a metal plate that is integrated into the substrate wafer and thermally coupled to the integrated circuit chip. The metal plate may have a thickness in excess of several layers of the substrate wafer. The metal plate may include a duct through which a thermally conductive fluid flows.

主权项

1. An electronic device, comprising:
a substrate wafer made of an insulating material and including an electrical connection network extending between a first face and a second face, said electrical connection network having a plurality of metal levels connected by vias; at least one integrated circuit chip mounted on the first face of the substrate wafer; a plurality of intermediate metal elements configured to mount the integrated circuit chip to the substrate wafer; a plurality of external metal elements mounted on an opposite side of the substrate wafer; a metal plate integrated into said substrate wafer and lying between intermediate ones of said metal levels, wherein the metal plate comprises protrusions extending from the metal plate through the substrate wafer and thermally connected to the plurality of intermediate metal elements and the plurality of external metal elements.