Semiconductor device and method for producing same

摘要

This semiconductor device (100A) includes: a substrate (2); a gate electrode (3) formed on the substrate (2); a gate insulating layer (4) formed over the gate electrode (3); an oxide semiconductor layer (5) formed on the gate insulating layer (4); source and drain electrodes (6s, 6d) electrically connected to the oxide semiconductor layer (5); a first transparent electrode (7) electrically connected to the drain electrode (6d); an interlayer insulating layer (8a) including portions formed on the source and drain electrodes (6s, 6d); and a second transparent electrode (9) formed on the interlayer insulating layer (8a). At least a portion of the second transparent electrode (9) overlaps with the first transparent electrode (7) with the interlayer insulating layer (8a) interposed between them. And the oxide semiconductor layer (5) and the first transparent electrode (7) are formed out of a same oxide film.

主权项

1. A semiconductor device comprising a substrate and a thin-film transistor formed on the substrate,
wherein the thin-film transistor includes: a gate electrode formed on the substrate; a gate insulating layer formed over the gate electrode; an oxide semiconductor layer formed on the gate insulating layer; and a source and drain electrodes electrically connected to the oxide semiconductor layer, the semiconductor device further includes: a gate connecting layer formed out of a same conductive film as the gate electrode; a source connecting layer formed out of a same conductive film as the source electrode; a first transparent electrode that contains an impurity at a higher concentration than the oxide semiconductor layer and is electrically connected to the drain electrode; an interlayer insulating layer formed over the source and drain electrodes, a first portion of the interlayer insulating layer that is located on the first transparent electrode contains an impurity at a higher concentration than a second portion thereof; a second transparent electrode formed on the interlayer insulating layer; and a transparent connecting layer formed out of a same conductive film as the second transparent electrode, wherein the source connecting layer is electrically connected to the gate connecting layer via the transparent connecting layer, and the oxide semiconductor layer and the first transparent electrode are formed out of a same oxide film.