发明名称 |
Method of manufacturing a winding-type solid electrolytic capacitor package structure using a lead frame |
摘要 |
A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body. |
申请公布号 |
US9378895(B2) |
申请公布日期 |
2016.06.28 |
申请号 |
US201514834896 |
申请日期 |
2015.08.25 |
申请人 |
Apaq Technology Co., Ltd. |
发明人 |
Chen Ming-Tsung;Lin Ching-Feng |
分类号 |
H01G9/00;H01G9/15;H01G4/232;H01G9/012;H01G9/10;H01G9/008 |
主分类号 |
H01G9/00 |
代理机构 |
Rosenberg, Klein & Lee |
代理人 |
Rosenberg, Klein & Lee |
主权项 |
1. A method of manufacturing a winding-type solid electrolytic capacitor package structure using a lead frame, comprising: providing a plurality of winding capacitors, wherein each winding capacitor has a winding body, a positive conductive lead pin extended from a first lateral side of the winding body, a negative conductive lead pin extended from a second lateral side of the winding body, a positive soldering foot soldered on an end of the positive conductive lead pin, and a negative soldering foot soldered on an end of the negative conductive lead pin;
pressing the winding body of each winding capacitor from a cylinder into a cuboid; removing the negative soldering foot of each winding capacitor by cutting; soldering the positive soldering foot of each winding capacitor on a connection bar; processing the winding capacitors by a carbonization process, a formation process and a polymer-impregnated process in sequence; removing polymer that has been formed on an end portion of the negative conductive lead pin of each winding capacitor; removing the positive soldering foot of each winding capacitor by cutting; respectively placing the winding capacitors on a plurality of conductive units, wherein each conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin of the corresponding winding capacitor and a negative conductive terminal electrically connected to the negative conductive lead pin of the corresponding winding capacitor; forming a plurality of package bodies to respectively enclose the winding capacitors, wherein the positive conductive terminal of each conductive unit has a first embedded portion electrically contacting the positive conductive lead pin of the corresponding winding capacitor and enclosed by the corresponding package body and a first exposed portion connected with the first embedded portion and exposed outside the corresponding package body, and the negative conductive terminal of each conductive unit has a second embedded portion electrically contacting the negative conductive lead pin of the corresponding winding capacitor and enclosed by the corresponding package body and a second exposed portion connected with the second embedded portion and exposed outside the corresponding package body; and bending the first exposed portion and the second exposed portion of each conductive unit along an outer surface of the corresponding package body. |
地址 |
Miaoli County TW |