发明名称 METHOD AND STRUCTURE FOR MOUNTING ELECTRONIC PART OF LED ASSEMBLY MODULE
摘要 PURPOSE:To prevent the breakdown of an electronic part when a lens plate is molded by insertion on a substrate, on which an LED and the electronic part are mounted. CONSTITUTION:An LED 2 and an electronic part 3 are mounted on a metal substrate 1. Then, a protecting layer 4, which covers the end part of the electronic part 3 in the flowing direction of synthetic resin for insert molding, is provided. A lens plate 5 is formed by the insert molding.
申请公布号 JPH07231118(A) 申请公布日期 1995.08.29
申请号 JP19940018686 申请日期 1994.02.15
申请人 MITSUBISHI CABLE IND LTD 发明人 SANO SHINICHI;MURATA HIROAKI
分类号 H01L23/28;G09F9/33;H01L21/56;H01L33/54;H01L33/56;H01L33/60;H01L33/64 主分类号 H01L23/28
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