SUBSTRATE TREATMENT DEVICE, METHOD FOR SEPARATING BONDED SUBSTRATE, AND METHOD FOR REMOVING ADHSEIVE

摘要

The embodiment of a substrate treatment device includes a treatment bath configured to store a treatment liquid in which a treatment object is to be immersed, a transport section configured to transport the treatment object, a temperature control section provided in at least one of the treatment bath and a position spaced from the treatment bath and configured to perform at least one of heating and cooling of the treatment object.
the treatment object is at least one of:
a laminated substrate including a device substrate, a support substrate, and an adhesive provided between the device substrate and the support substrate,
the device substrate with the adhesive attached thereto, and
the support substrate with the adhesive attached thereto.