| 摘要 |
PROBLEM TO BE SOLVED: To inhibit short circuit of a semiconductor chip caused by overflow of a solder fillet or overflow of a solder fillet from a side end of a base plate.SOLUTION: In a power module, each length of solder fillets 51a, 51b of a first semiconductor chip 11, which are formed on sides located on places at shortest distances out of half a distance from a first side of the first semiconductor chip 11 to a second semiconductor chip 12 on one side adjacent to the first side, half a distance from a second side of the first semiconductor chip 11 to a third semiconductor chip 13 on one side adjacent to the second side, and a distance from at least one of third and fourth sides of the first semiconductor chip 11 to one of side ends E1, E2 of a base plate 101 is formed shortest.SELECTED DRAWING: Figure 3 |
