| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated structure in which adhesion between a conductive layer and a resin layer can be improved.SOLUTION: A laminated structure related to one embodiment of the present invention comprises a conductive layer containing metal, and a resin layer laminated on one surface of the conductive layer. The resin layer contains a resin portion formed of the resin composition, and an inorganic portion formed of the same metal as the metal contained in the conductive layer, a metal compound of the metal or a combination thereof. A content of the inorganic portion in a region of 100 nm or less from an interface of the conductor layer in the resin layer is 10 vol.% or more and 80 vol% or less. The metal is preferably transition metal, and more preferably is copper. The metal compound is preferably a metal oxide. It is preferred that a content of the inorganic portion in the region becomes smaller with an increase in distance from the interface of the conductive layer.SELECTED DRAWING: Figure 1 |
