RFID integrated circuits with large contact pads

摘要

An RFID IC assembly having a repassivation layer and a conductive redistribution layer may be assembled onto a tag substrate with an additional layer. The additional layer includes one or more etchants for creating an opening in a nonconductive barrier layer between the assembly and the substrate, and may also include an adhesive for attaching the assembly to the substrate.

主权项

1. A Radio Frequency Identification (RFID) tag precursor comprising:
an assembly including an RFID integrated circuit (IC), a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface, in which at least a first portion of the redistribution layer is electrically connected to the IC through a first opening in the repassivation layer, a substrate including a first antenna terminal; a second opening, formed by an etchant, in a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer, and an adhesive attaching the assembly to the substrate; wherein
a first electrical connection is formed between the first antenna terminal and the first portion of the redistribution layer through the second opening; andthe first opening and the second opening are nonoverlapping.